HID Global Passes High-level MasterCard Certification; Results Reinforce Company's Commitment to Quality

The MasterCard Card Quality Management (CQM) audit covers HID Global’s contactless and dual interface inlays for banking and payment solutions.
Company’s contactless and dual interface inlays have been successfully tested and audited for nine years; MasterCard only recently introduced a specialized audit & label for dual interface antennas.
Worldwide, a limited number of production sites meet the CQM requirements.

Dubai, UAE, February 8, 2016 – HID Global®, a worldwide leader in secure identity solutions, today announced that its identification technologies products for banking and payment smart card industry have successfully passed MasterCard’s 2015 Card Quality Management (CQM) audit for dual interface inlays.  HID Global’s production site in Malaysia has passed the required CQM test procedures and is entitled to carry the corresponding CQM Label. Worldwide, only a limited number of inlay production sites meet these requirements.

“Dual interface inlays are a core part of HID Global’s secure identity solutions for payment applications andthe CQM certification provide solid affirmation of our dedication to consistently ensuring the highest quality for Genuine HID® products and solutions,” said Marc Bielmann, vice president and managing director, Identification Technologies with HID Global.  “The certification provides assurance to card manufacturers and the smart card industry overall, and we are pleased to be one of the first companies to offer products that have passed MasterCard’s latest Card Quality Management requirements.”

HID Global’s contactless and dual interface inlays have been successfully tested and audited for nine years, though MasterCard only recently introduced a specialized audit for dual interface inlays. The CQM scheme guarantees consistent and traceable quality to the card issuer, and expands MasterCard’s overall approval process that defines strict requirements for manufacturing sites and processes.